Original design
Two pairs of front/back panels were ordered at Schaeffer in 1.5 mm thickness since 1.2 mm is not available.
Back panel was cut at Makilab by @tnt .
After trying to fit the back panel, it became obvious that the calculations were off and the height of the PCB (1.6 mm) was not properly accounted for, resulting in openings that were all 1.6 mm too low.
First revision done after the 1.6 mm offset error was noticed. It was done even before the rev 0.0 panels were back from Schaeffer.
The SMA hole height is too low. Nominal height above PCB was 6.4mm but that's for the TE-Connectivity part. The SMA we're using is more like 6.85mm above the surface. To fix this, the hole will be changed to be taller than wide to accomodate both parts.
All the square opening (single RJ45, dual RJ45, USB) have their excess located at the top and have their bottom flush with the expected pcb height. This is different from the circular opening which are aligned on their center. So change the positions so the excess clearance is evenly distributed top/bottom of the expected position.
Production version, sent to manufacturer for production.
Converted the SMA opening from a pure-circle to two half circles connected by lines. The upper half circle is 0.5 mm above the previous center
Moved USB, 1xRJ45 and 2xRJ45 opening 0.2 mm down
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